Reduction of surface copper thickness on surface mount printed w

Details Reduction of surface copper thickness on surface mount printed w Reduction of surface copper thickness on surface mount printed w

1994-08-18

1997-01-07

Dang, Thi

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 17, 216 20, 216 38, H05K 300

Patent

active

055913539

ABSTRACT:
A method of fabricating a printed wiring board (1) and a printed wiring board module (17) by providing a first board (1) having a pair of major opposing surfaces, a via (3) having walls extending between the surfaces and a layer of copper (5) disposed on at least one surface and extending along the walls of the via. The copper disposed in the via is protected against a subsequent etching of the copper on the surface by filling the remaining portion of the via with an epoxy (7) and then reducing the thickness of the layer of copper on the surface. The layer of copper and the epoxy are then planarized. A core layer and a second board are then provided and the first and second boards are secured to opposing sides of the core layer. A second via having walls and extending through the first and second boards and the core layer is then formed and a layer of copper is disposed on the walls of the second via and the surface. The electrically conductive material on the surface is then patterned and etched to form an electrically conductive pattern.

REFERENCES:
patent: 4529477 (1985-07-01), Lundberg et al.
patent: 4964948 (1990-10-01), Reed

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