Plastic article or earthenware shaping or treating: apparatus – Preform reshaping or resizing means: or vulcanizing means... – Surface deformation means only
Reexamination Certificate
2009-10-19
2011-12-13
Ewald, Maria Veronica (Department: 1744)
Plastic article or earthenware shaping or treating: apparatus
Preform reshaping or resizing means: or vulcanizing means...
Surface deformation means only
C425S4360RM, C264S293000
Reexamination Certificate
active
08075299
ABSTRACT:
Separation of an imprint lithography template and a patterned layer in an imprint lithography process may result in stress to features of the template and/or features of the patterned layer. Such stress may be reduced by minimizing open areas on the template, including dummy features within the open areas, and/or selective positioning of features on the template.
REFERENCES:
patent: 6873087 (2005-03-01), Choi et al.
patent: 6932934 (2005-08-01), Choi et al.
patent: 6936194 (2005-08-01), Watts
patent: 7060402 (2006-06-01), Choi et al.
patent: 7077992 (2006-07-01), Sreenivasan et al.
patent: 7157036 (2007-01-01), Choi et al.
patent: 7179396 (2007-02-01), Sreenivasan
patent: 7396475 (2008-07-01), Sreenivasan
patent: 2003/0039897 (2003-02-01), Morita
patent: 2004/0065252 (2004-04-01), Sreenivasan et al.
patent: 2004/0065976 (2004-04-01), Sreenivasan et al.
patent: 2004/0168613 (2004-09-01), Nguyen et al.
patent: 2004/0192041 (2004-09-01), Jeong et al.
patent: 2004/0211754 (2004-10-01), Sreenivasan
patent: 2005/0064344 (2005-03-01), Bailey et al.
patent: 2005/0187339 (2005-08-01), Xu et al.
patent: 2005/0193364 (2005-09-01), Kotani et al.
patent: 2006/0145398 (2006-07-01), Bailey et al.
patent: 2006/0192320 (2006-08-01), Tokita et al.
patent: 2006/0230959 (2006-10-01), Meijer et al.
patent: 2007/0126156 (2007-06-01), Mahadevan et al.
patent: 2007/0132152 (2007-06-01), Choi et al.
patent: 2007/0170617 (2007-07-01), Choi et al.
patent: 2008/0203271 (2008-08-01), Okinaka et al.
patent: 20122179 (2004-09-01), None
patent: WO 2010/047769 (2010-04-01), None
Landis et al. Stamp design effect on 100nm feature size for 8 inch nanoimprint lithography, Nanotechnology, IOP. Bristol GB, vol. 17 No. 10, pp. 2701-2709.
Landis et al., Quantitative characterizations of a nanopatterned bonded wafer: force determination for nanoimprint lithography stamp removal, Nanotechnology 19, 2008, at 125305 (13pp) Feb. 20, 2008.
International Search Report and Written Opinion of the International Searching Authority, Application No. PCT/US2009/005692, Jan. 18, 2010, 10 pages.
Sreenivasan Sidlgata V.
Xu Frank Y.
Ewald Maria Veronica
Fish & Richardson P.C.
Flanagan Heather L.
King Cameron A.
Molecular Imprints, Inc.
LandOfFree
Reduction of stress during template separation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reduction of stress during template separation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reduction of stress during template separation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4261864