Reduction of package height in a stacked die configuration

Details Reduction of package height in a stacked die configuration Reduction of package height in a stacked die configuration

2011-04-26

2011-04-26

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S125000, 28, 28, 28

Reexamination Certificate

active

07932131

ABSTRACT:
A method and structure for reducing the size of semiconductor package is disclosed. In one example embodiment, a method for stacking dies of a semiconductor package includes forming a set of insulated bonding wires between respective bonding pads of a first semiconductor integrated circuit die and a conductive layer electrically detached from the respective bonding pads, applying an adhesive material on a top surface of the first semiconductor integrated circuit die, and securing a second semiconductor integrated circuit die one the top surface of the first semiconductor integrated circuit die with the adhesive material.

REFERENCES:
patent: 5310702 (1994-05-01), Yoshida et al.
patent: 5804004 (1998-09-01), Tuckerman et al.
patent: 5950100 (1999-09-01), Shingai
patent: 6177726 (2001-01-01), Manteghi
patent: 6258632 (2001-07-01), Takebe
patent: 6894398 (2005-05-01), Pon
patent: 7202109 (2007-04-01), Zakharian et al.
patent: 7215008 (2007-05-01), Kim et al.
patent: 7215031 (2007-05-01), Egawa
patent: 7374969 (2008-05-01), Cho et al.
patent: 2006/0097374 (2006-05-01), Egawa
patent: 2006/0097404 (2006-05-01), Cho et al.
patent: 2008/0131999 (2008-06-01), Takiar et al.

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