Reduction of coefficient of friction for thermal addition...

Details Reduction of coefficient of friction for thermal addition... Reduction of coefficient of friction for thermal addition...

2007-07-17

2007-07-17

Moore, Margaret G. (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

C528S031000, C528S032000, C525S478000

Reexamination Certificate

active

11008686

ABSTRACT:
The invention is directed to a thermal addition curable solventless silicone release composition having a reduced coefficient of friction and improved slip characteristics. The invention is also directed to a method for producing a thermal addition curable solventless silicone release composition on a substrate by applying the thermal addition curable solventless release composition of the invention to a substrate and curing the coating on the substrate using heat. The invention is further directed to a thermal addition curable solventless silicone release coated article having a reduced coefficient of friction and improved slip characteristics.

REFERENCES:
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patent: 4753978 (1988-06-01), Jensen
patent: 4946878 (1990-08-01), Jensen et al.
patent: 5006580 (1991-04-01), Kasuya et al.
patent: 5432006 (1995-07-01), Kessel et al.
patent: 5706098 (1998-01-01), Clark et al.
patent: 5977226 (1999-11-01), Dent et al.

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