Reduction atmosphere workpiece joining

Details Reduction atmosphere workpiece joining Reduction atmosphere workpiece joining

1985-08-12

1986-12-30

Jordan, M.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228220, B23K 3536

Patent

active

046322957

ABSTRACT:
A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.

REFERENCES:
patent: 3203084 (1965-08-01), Best
patent: 3340602 (1967-09-01), Hontz
patent: 3468016 (1969-09-01), Issoire
patent: 3531853 (1970-10-01), Klomp
patent: 3665590 (1972-05-01), Percival
patent: 3730782 (1973-05-01), Poliak et al.
patent: 3869787 (1975-03-01), Umbaugh
patent: 3882596 (1975-05-01), Kendziora et al.
patent: 3899074 (1975-08-01), Lucas
patent: 3900151 (1975-08-01), Schoer et al.
patent: 3941299 (1976-03-01), Godfrey
patent: 3966110 (1976-06-01), Boynton
patent: 4000016 (1976-12-01), Lazzarini et al.
patent: 4081121 (1978-03-01), Picard
patent: 4127692 (1978-11-01), Boynton
patent: 4143005 (1979-03-01), Packer
patent: 4215025 (1980-07-01), Packer et al.
patent: 4223826 (1980-09-01), Usui
patent: 4269870 (1981-05-01), Boynton
patent: 4371912 (1983-02-01), Guzik
patent: 4496098 (1985-01-01), Kawakatsu
patent: 4504007 (1985-03-01), Anderson et al.
The Merck Index, 10th Edition, by Martha Windholz, 1983.

Affiliated with

Also associated with

Rating

Reduction atmosphere workpiece joining does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reduction atmosphere workpiece joining, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reduction atmosphere workpiece joining will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1542524