Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2011-01-25
2011-01-25
Vu, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C257S783000, C257SE21503
Reexamination Certificate
active
07875503
ABSTRACT:
Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a die attach area, and forming a layer on the substrate outside of the die attach area. The layer may be formed from a fluoropolymer material. The method also includes coupling a die to the substrate in the die attach area, wherein a gap remains between the die and the die attach area. The method also includes placing an underfill material in the gap and adjacent to the layer on the substrate. Examples of fluoropolymer materials which may be used include polytetrafluoroethylene (PTFE) and perfluoroalkoxy polymer resin (PFA). Other embodiments are described and claimed.
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Dang Ngoc K.
Gokhale Shripad
Pandey Samir
Saha Bijay S.
Toyama Munehiro
Intel Corporation
Konrad Raynes & Victor LLP
Raynes Alan S.
Taylor Earl N
Vu David
LandOfFree
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