Oscillators – Solid state active element oscillator – Transistors
Reexamination Certificate
2007-02-06
2007-02-06
Pascal, Robert (Department: 2817)
Oscillators
Solid state active element oscillator
Transistors
C331S105000, C331S167000, C257S778000, C257S784000
Reexamination Certificate
active
10952343
ABSTRACT:
Disclosed are integrated circuits having multiple electromagnetically emissive devices, such as LC oscillators. The devices are formed on an integrated circuit substrate and are given different planar orientations from each other. Particular integrated circuit packages disclosed are “flip-chip” packages, in which solder bumps are provided on the integrated circuit substrate for flipping and mounting of the finished integrated circuit upon a printed circuit board or other substrate. The solder bumps provide conductive connections between the integrated circuit and the substrate. The orientations and positioning of the emissive devices are such that one or more of the solder bumps are interposed between neighboring emissive devices to act as an electromagnetic shield between them.
REFERENCES:
patent: 6462423 (2002-10-01), Akram et al.
patent: 6627999 (2003-09-01), Akram et al.
patent: 6703714 (2004-03-01), Akram et al.
patent: 6777774 (2004-08-01), Beng et al.
patent: 6825554 (2004-11-01), Liew et al.
patent: 6841886 (2005-01-01), Nakata et al.
patent: 2002/0041216 (2002-04-01), Welland et al.
patent: 2002/0153166 (2002-10-01), Chang
patent: 2003/0127704 (2003-07-01), Kobayashi et al.
patent: 2005/0029632 (2005-02-01), McKinzie et al.
Ali Hassan O.
Ramaswamy Sridhar
Wu Song
Brady W. James
Goodley James
Pascal Robert
Stewart Alan K.
Telecky , Jr. Frederick J.
LandOfFree
Reducing the coupling between LC-oscillator-based... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reducing the coupling between LC-oscillator-based..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reducing the coupling between LC-oscillator-based... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3885406