Reducing plating anomalies in electroplated fine geometry conduc

Details Reducing plating anomalies in electroplated fine geometry conduc Reducing plating anomalies in electroplated fine geometry conduc

1989-02-17

1991-01-29

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 321, C25D 502

Patent

active

049884131

ABSTRACT:
An etching process provides a surface of a seed layer substantially free of surface anomalies that could effect the morphology of conductive features that are electroplated onto the surface of the seed layer between dielectric features photolithographically patterned in a dielectric composition. The etching serves to remove at least several monolayers from the upper surface of the seed layer. The conductive features electroplated thereon exhibit excellent morphology and edges that are substantially free of surface roughness and nodular film growth.

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Chakravorty et al., Photosensitive Polyimide as a Dielectric in High Density Thin Film Copper-Polyimide Interconnect Structures, Abstract of Paper presented at the Electrochemical Society Conference, May 1988, Atlanta, Ga., published Mar. 23, 1988.
Endo et al., Material and Processing Technologies of Polyimide for Advanced Electronic Devices, J. Electrochem. Soc.: Solid-State Science and Technology, vol. 134, No. 10, Oct. 1987.
Moriya et al., High-Density Multilayer Interconnection with Photo-Sensitive Polyimide Dielectric and Electroplating Conductor, proceedings 34th Electronic Component Conference IEEE, pp. 82-87, 1984.
Pfeifer et al., Direct Photoimaging of Fully Imidized Solvent-Soluble Polimides, presented at Second International Conference on Polyimides, Mid-Hudson Section SPE, Oct. 30-Nov. 1, 1985, Ellenville, N.Y.
Rubner et al., A Photopolymer-The Direct Way to Polyimide Patterns, Photographic Science and Engineering, vol. 23, No. 5, Sep./Oct. 1979, pp. 303-309.

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