Reducing or eliminating cross-talk at device-substrate...

Details Reducing or eliminating cross-talk at device-substrate... Reducing or eliminating cross-talk at device-substrate...

2006-12-05

2006-12-05

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S262000, C174S250000, C439S607560, C361S816000

Reexamination Certificate

active

07145083

ABSTRACT:
Inter-layer shielding is employed to shield printed circuit board transmission lines from EMI and cross-talk at traversals between adjacent inner layers, between inner layers separated by one or more inner layers, between an outer layer and an adjacent inner layer, between an outer layer and an inner layer separated by one or more inner layers, and between an outer layer or inner layer and a component. Inter-layer shielding may be employed in conjunction with intra-layer shielding to provide shielding for an entire run of a transmission line spanning multiple layers. Inter-layer shielding may also be employed around component contacts such as electrically conducting pins. The shielding around the component contacts is designed to mate with a second portion of inter-layer shielding connected with intra-layer shielding such that an overlap is formed.

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