Reducing contamination in immersion lithography

Details Reducing contamination in immersion lithography Reducing contamination in immersion lithography

2011-01-11

2011-01-11

Nguyen, Hung Henry (Department: 2882)

Photocopying

Projection printing and copying cameras

Detailed holder for photosensitive paper

C355S053000, C355S077000

Reexamination Certificate

active

07869002

ABSTRACT:
A method for reducing contamination in immersion lithography includes retaining a semiconductor wafer on a support surface of a wafer chuck, the wafer chuck having a gap therein, the gap located adjacent an outer edge of the wafer, and the gap containing a volume of immersion lithography fluid therein; and providing a fluid circulation path within the wafer chuck so as to facilitate the radial outward movement of the immersion lithography fluid in the gap, thereby maintaining a meniscus of the immersion lithography fluid at a selected height with respect to a top surface of the semiconductor wafer.

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