Reduced-stress heat sink device

Details Reduced-stress heat sink device Reduced-stress heat sink device

1986-07-18

1988-06-28

Lazarus, Ira S.

Heat exchange

Heat transmitter

174 16HS, 357 81, F28F 700

Patent

active

047532904

ABSTRACT:
A heat sink for adhesive attachment to an integrated circuit package has a base plate with gapped areas dividing the plate into sectors. A series of radial fin elements extend from the base plate except at the gapped areas where a bridging fin element spans the gap to effectively help reduce the stresses caused by heat cycling and permit the adhesive bond to be relatively undisturbed.

REFERENCES:
patent: 3242984 (1966-03-01), Delpeyrow et al.
patent: 3262028 (1966-07-01), Hermann
patent: 3313339 (1967-04-01), Coe
patent: 3327776 (1967-06-01), Butt
patent: 3342255 (1967-09-01), Risk et al.
patent: 3566958 (1971-03-01), Zelina
patent: 3592260 (1971-07-01), Berger
patent: 3716098 (1973-02-01), Dotto
patent: 4144932 (1979-03-01), Voigt
patent: 4620216 (1986-10-01), Horvath
"Pin Array Package with Heat Removal from Pin Side", Hedeman & Richards, IBM Tech. Bulletin, vol. 14, No. 11, Apr., 1972, p. 3349.

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