Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-11-05
2010-12-07
Smoot, Stephen W (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257S777000, C257S786000
Reexamination Certificate
active
07847386
ABSTRACT:
In accordance with the present invention, there is provided multiple embodiments of a reduced size stackable semiconductor package. In a basic embodiment of the present invention, the semiconductor package comprises a bulk layer having at least one first bond pad formed therein. At least one active layer is formed on the bulk layer and electrically coupled to the first bond pad. Additionally, at least one second bond pad is formed on the active layer and is electrically coupled thereto. A protection layer is formed on that surface of the active layer having the second bond pad formed thereon, the protection layer also partially encapsulating the second bond pad. In other embodiments of the present invention, the above-described semiconductor package is provided in a stacked arrangement and in a prescribed pattern of electrical communication with one or more additional, identically configured semiconductor packages. In these stacked arrangements, one or more interposers and/or solder balls may optionally integrated into such semiconductor package stacks. In other embodiments of the present invention, a semiconductor package is provided wherein a semiconductor package stack is itself electrically connected to a substrate and covered with an encapsulant material which ultimately hardens into a package body.
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Kim Bong Chan
Na Jae Young
Song Jae Kyu
Amkor Technology Inc.
Smoot Stephen W
Stetina Brunda Garred & Brucker
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