Reduced semiconductor size package

Details Reduced semiconductor size package Reduced semiconductor size package

1991-12-23

1995-07-18

LeDynh, Bot

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257684, 257685, 257690, 257704, 257787, 361728, 361729, 361735, H01L 2328

Patent

active

054343577

ABSTRACT:
A sealed semiconductor unit includes an electrical component within a defined area on a semiconductor material. A cover with the dimensions of the semiconductor defined area is placed over the semiconductor material with a sealant there between. The dimensions of the cover are aligned with the dimensions of the semiconductor. The sealed unit includes electrical contacts extending from outside the sealed unit to the electrical component within the sealed unit on the semiconductor material. The sealed semiconductor unit, including the cover, the semiconductor material, and the electrical component, has an area of the semiconductor material.

REFERENCES:
patent: 3310711 (1967-03-01), Hangstefer
patent: 3922705 (1975-11-01), Yerman
patent: 4322737 (1982-03-01), Sliwa, Jr.
patent: 4970577 (1990-11-01), Ogihara et al.
patent: 5013871 (1991-05-01), Mahulikar et al.
patent: 5023398 (1991-06-01), Mahulikar et al.
patent: 5025114 (1991-06-01), Braden
patent: 5086018 (1992-02-01), Conru et al.
patent: 5107074 (1992-04-01), Noll et al.

Affiliated with

Also associated with

Rating

Reduced semiconductor size package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reduced semiconductor size package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reduced semiconductor size package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2419635