Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1993-02-18
1994-12-27
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
20429825, 20429835, 115719, 414217, 414DIG1, 414DIG5, H01L 2100
Patent
active
053762126
ABSTRACT:
A reduced-pressure processing apparatus which comprises a wafer table, two processing chambers, and three load-locking chambers. The wafer table temporarily supports a workpiece. In the first processing chamber, a first process is performed on a workpiece under a reduced pressure, In the second processing chamber, a second process is performed on the workpiece under a reduced pressure. The first load-locking chamber is connected to the first processing chamber, for allowing to be pneumatically disconnected from the first processing chamber, and allowing a passage of a workpiece into and from the first processing chamber and to and from the temporary holding means. The second load-locking chamber is connected to the second processing chamber, for allowing to be pneumatically disconnected from the second processing chamber, and allowing a passage of a workpiece into and from the second processing chamber and to and from the temporary supporting means. The third load-locking chamber is located between the first and second processing chambers and connected thereto, for allowing to be pneumatically disconnected from the first and second processing chambers, and allowing a passage of a workpiece into and from the first and second processing chambers and to and from the temporary holding means.
REFERENCES:
patent: 4785962 (1988-11-01), Toshima
patent: 4825808 (1989-05-01), Takahashi et al.
patent: 4851101 (1989-07-01), Hutchinson
patent: 4908095 (1990-03-01), Kagatsume et al.
patent: 5217501 (1993-06-01), Fuse et al.
Dang Thi
Tokyo Electron Yamanashi Limited
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