Reduced porosity copper deposition

Details Reduced porosity copper deposition Reduced porosity copper deposition

2011-08-02

2011-08-02

Kornakov, Michael (Department: 1714)

Coating processes

With post-treatment of coating or coating material

Chemical agent applied to treat coating

C257SE29006, C257S325000, C427S058000, C427S098100, C427S098400, C427S099500, C427S229000, C427S304000, C427S305000, C427S306000, C427S314000, C427S430100, C427S457000, C427S556000, C427S560000, C427S581000, C428S209000, C428S411100

Reexamination Certificate

active

07989029

ABSTRACT:
A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.

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