Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1996-09-19
1998-10-06
Ballato, Josie
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
G01R 3126
Patent
active
058182527
ABSTRACT:
An integrated circuit assembly using tape automated bonding (TAB) reduces the number of TAB test pads formed upon the TAB film, for purposes of testing the integrated circuit prior to surface mounting, by sharing at least some of such test pads between at least two output terminals of the integrated circuit. A control signal indicates to the integrated circuit that a TAB test mode of operation is in effect. A second control signal indicates which of the two output signals should be enabled to the shared test pad during the TAB test mode. Multiplexers are provided at the output terminals, and are responsive to such control signals, for selectively allowing one of such output signals to be conducted to the test pad, while temporarily presenting a high impedance at the other output terminal. A method of testing such integrated circuit assembly includes the step of trimming such test pads from the tape automated bonding film after testing and before surface mounting.
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patent: 4918385 (1990-04-01), Shreeve
patent: 5132614 (1992-07-01), Sakumoto et al.
patent: 5150047 (1992-09-01), Saito et al.
patent: 5418470 (1995-05-01), Dagostino et al.
patent: 5528256 (1996-06-01), Erhart et al.
Surface Mount Technology, Vardaman, IEEE Press, 1993, pp. 165-230. (Month Unavailable).
Erhart Richard Alexander
Fullman Edward Carl
Kozicek James Richard
Nelson Richard Brian
Ballato Josie
Kobert Russell M.
Vivid Semiconductor, Inc.
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