Reduced metal etch rates using stripper solutions containing...

Details Reduced metal etch rates using stripper solutions containing... Reduced metal etch rates using stripper solutions containing...

2007-10-30

2010-02-02

Boyer, Charles I (Department: 1796)

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

C510S175000, C510S178000, C510S254000, C510S259000, C510S261000, C510S264000, C134S001200, C134S001300

Reexamination Certificate

active

07655608

ABSTRACT:
Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper or cobalt salt with or without an added amine to improve solubility of the copper or cobalt salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

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International Search Report dated Jan. 12, 2009 from PCT/US2008/071485, 5 pgs.

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