Reduced internal temperature technique for hermetic sealing of e

Details Reduced internal temperature technique for hermetic sealing of e Reduced internal temperature technique for hermetic sealing of e

1982-01-18

1984-11-13

Weisstuch, Aaron

Metal working

Method of mechanical manufacture

Assembling or joining

174 52FP, 219 85BA, 219 85BM, 357 81, H01L 2148, H01L 2308, B65D 728, B23K 106

Patent

active

044817088

ABSTRACT:
A technique for enclosing microelectronic circuit elements in hermetically sealed packages comprising a planar ceramic substrate with a box-like ceramic cover sealed thereto by a fused glass coating. The glass sealant is applied to the substrate in the form of a paste which thereafter is fired at high temperature and cooled to produce a smooth glass coating. With the cover in place on the substrate, the glass coating is remelted by heat developed by infra-red radiation impinging on all sides of the package structure from heaters in an infra-red furnace. A reflective shield on top of the cover reduces the inflow of heat through that surface, and a heat sink beneath the substrate removes heat, thereby to reduce the temperature rise experienced by circuit elements in the package interior.

REFERENCES:
patent: 3283124 (1966-01-01), Kawecki
patent: 3404215 (1968-10-01), Burks et al.
patent: 3683146 (1972-08-01), Nugent et al.
patent: 3937388 (1978-02-01), Zimmerman
patent: 4291815 (1981-09-01), Gordon et al.

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