Reduced inter-module circuit path crossovers on circuit boards m

Details Reduced inter-module circuit path crossovers on circuit boards m Reduced inter-module circuit path crossovers on circuit boards m

1996-07-11

1997-04-08

An, Meng-Ai T.

Boots, shoes, and leggings

39520002, 364488, 364489, 364490, 364491, 364DIG1, G06F 1560

Patent

active

056197195

ABSTRACT:
The number of circuit path crossover points on boards mounting plural connected multichip modules is substantially reduced over the number that would otherwise be required. For 4-sided modules and boards, the modules are arranged on the board in such a way that their inter-connecting north-east-south-west ports are successively reordered to N-S-E-W. Additionally, further advantage in reducing crossover vias may be gained by combining the reordering with a phased rotation of the modules from their nominal congruent board position. For the 4-sided module, these expedients virtually eliminate crossover vias between the east and west ports. It also provides for all MCMs a ready common bus structure located at a common interior area of the mounting board, to which the E- and W-ports are oriented. The invention is applicable to a class of multi-sided, multi-chip modules on boards with a like number of sides.

REFERENCES:
patent: 5295082 (1994-03-01), Chang et al.
Val et al., "3-D Interconnection for Ultra-Dense Multichip Modules", IEEE Oct. 1990, pp. 814-821.

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