Communications: radio wave antennas – Antennas – With coupling network or impedance in the leadin
Reexamination Certificate
2009-02-10
2011-11-15
Wimer, Michael C (Department: 2821)
Communications: radio wave antennas
Antennas
With coupling network or impedance in the leadin
C257S728000, C257S773000
Reexamination Certificate
active
08059057
ABSTRACT:
According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The dielectric is attached to a metal substrate. The pocket has substantially vertical sidewalls. An integrated circuit is disposed in the pocket. Opposing sides of the integrated circuit are substantially parallel to the sidewalls of the pocket. An interconnect electrically couples the integrated circuit to a bond pad disposed on the outer surface of the dielectric layer. The interconnect has a length that is minimized to result in reduced inductance of the semiconductor device.
REFERENCES:
patent: 4771294 (1988-09-01), Wasilousky
patent: 6057593 (2000-05-01), Iovdalsky et al.
patent: 6246377 (2001-06-01), Aiello et al.
patent: 6545227 (2003-04-01), Silverman
patent: 7528792 (2009-05-01), Mason et al.
patent: 2003/0012006 (2003-01-01), Silverman
patent: 2003/0117331 (2003-06-01), Schamberger et al.
patent: 0 725 441 (1996-08-01), None
patent: 0 732 745 (1996-09-01), None
patent: 1 280 392 (2003-01-01), None
patent: 60-133992 (1985-07-01), None
patent: 2002290150 (2002-04-01), None
patent: 2003-060116 (2003-02-01), None
patent: WO 02/23620 (2002-03-01), None
English Translation of Office Action of Japanese Patent Office, Patent Application No. 2008-515735, 16 pages, Dec. 8, 2009.
Edward et al., “W-Band Active Transmit and Received Phased Array Antennas,” IEEE MTT-S Digest, pp. 1095-1098, May 16, 1995.
Wein, Advanced Ceramic Packaging for Microwave and Millimeter Wave Applications, IEEE Transactions on Antennas and Propagation, pp. 940-948, Sep. 1, 1995.
PCT Notification of Transmittal of the International Search Report and the Written Opinion, International Application No. PCT/US2006/020014, 13 pages, Dec. 26, 2006.
State Intellectual Property Office of the People's Republic of China, First Office Action, Filing No. 200680020042.5, 13 pages, Aug. 28, 2009.
English translation of The Second Office Action of China IPO, Patent Application 2006-0020042.5, along with Chinese language office action; 28 pages, Jun. 29, 2010.
English translation of Office Action of Japan Patent Office, Patent Application 2008-515735, Mailing date Jun. 15, 2010, 27 pages.
English translation of the Third Office Action of China IPO, Patent Application 2006-0020042.5, along with Chinese language office action; 6 pages, Oct. 9, 2010.
Communication Pursuant to Article 94(3) EPC for Application No. 06 771 020.2-2203; (5 pages), Nov. 10, 2010.
Bedinger John Michael
Mason James S.
Rajendran Raj
Baker & Botts L.L.P.
Raytheon Company
Wimer Michael C
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