Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2007-05-15
2007-05-15
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S778000, C257S782000, C257S783000, C257SE23004
Reexamination Certificate
active
10818323
ABSTRACT:
The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one particular example, a microelectronic component package includes a substrate and a microelectronic component that has a first surface with a surface area greater than that of a second surface. A cementitious material, e.g., a die attach paste, may attach the second surface of the microelectronic component to a mounting surface of the substrate, with the cementitious material extending outwardly beyond a perimeter of the second surface and covering a surface area of the mounting surface that is no greater than the surface area of the first surface. Such a microelectronic component package may be formed with a smaller footprint or, alternatively, may include a microelectronic component having larger dimensions in a microelectronic component package of the same size.
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Mandala Jr. Victor A.
Perkins Coie LLP
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