Reduced field implant for dynamic memory cell array

Metal treatment – Compositions – Heat treating

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29571, 29576B, 148187, 357 23, 357 91, H01L 21263, G11C 1140, G11C 1700

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active

043881211

ABSTRACT:
A dynamic read/write memory cell of the one-transistor N-channel silicon gate type is made by a double-level polysilicon process in which the implant dosage is reduced for the channel stop regions beneath the field oxide. This causes the signal level on the bit lines to be improved, and also reduces leakage problems.

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