Reduced cycle process for the manufacture of printed circuits, a

Details Reduced cycle process for the manufacture of printed circuits, a Reduced cycle process for the manufacture of printed circuits, a

1990-06-21

1992-04-14

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, C23C 2600

Patent

active

051046873

ABSTRACT:
A process for manufacturing printed circuits provided with through holes, which comprises a cleaning pretreatment including a possible treatment by an organic solvent, a treatment in an alcaline solution of permanganate and a treatment for permanganate reduction, and a subsequent metallization treatment including a treatment for conditioning the walls of the through holes, a treatment for mordanting the copper surfaces, a precatalysis treatment, a catalysis treatment and a metallization treatment by a chemical copper both, wherein three treatments, namely reducing the permanganate, conditioning the walls of the through holes and mordanting the copper surfaces, are performed in a single step. The treatment for conditioning the walls of the through holes is performed by means of non-surfactant, water soluble polymers belonging to the group of the cationic polyelectrolytes. The composition for carrying out three treatments in a single step comprises an acid, hydrogen peroxide, a stabilizer for the hydrogen peroxide and a non-surfactant conditioner belonging to the group of the cationic polyelectrolytes.

REFERENCES:
patent: 3698940 (1972-10-01), Mersereau
patent: 4353954 (1982-10-01), Yamaoka
patent: 4425380 (1984-01-01), Nuzzi
patent: 4430154 (1984-02-01), Stahl
patent: 4515829 (1985-05-01), Deckert
patent: 4610895 (1986-09-01), Tubergen
patent: 4751106 (1988-06-01), Wilkinson
patent: 4839084 (1989-06-01), Ouhadi
patent: 4874477 (1989-10-01), Pendleton
patent: 4948630 (1990-08-01), Courduvelis

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