Reduced-crosstalk wirebonding in an optical communication...

Details Reduced-crosstalk wirebonding in an optical communication... Reduced-crosstalk wirebonding in an optical communication...

2011-01-18

2011-01-18

Dang, Phuc T (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S784000, C257S786000, C438S208000, C438S912000

Reexamination Certificate

active

07872325

ABSTRACT:
Wirebonds are formed to couple an opto-electronic device chip having two or more opto-electronic devices to a signal processing chip. Two or more mutually adjacent wirebond groups, each corresponding to one of the opto-electronic devices, are formed. For example, each wirebond group can include a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip, a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, and a third wirebond coupling the opto-electronic device chip to the signal processing chip.

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patent: 6992377 (2006-01-01), Zhou et al.
patent: 2002/0089069 (2002-07-01), Lamson et al.
patent: 2008/0227284 (2008-09-01), Rebelo et al.
patent: 2009/0189059 (2009-07-01), Smith

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