Reduced collateral damage bomb (RCDB) and system and method...

Details Reduced collateral damage bomb (RCDB) and system and method... Reduced collateral damage bomb (RCDB) and system and method...

2011-08-09

2011-08-09

Bergin, James S (Department: 3641)

Ammunition and explosives

Shells

C102S479000, C102S382000

Reexamination Certificate

active

07992498

ABSTRACT:
A reduced collateral damage bomb (RCDB) bomb casing is described and disclosed along with the system and method for making it. The RCDB bomb casing may be formed from conventional or penetrating warhead bomb casings. The RCDB bomb casing has a filler material/materials disposed on the interior walls that will assist in controlling the collateral damage caused by the finished bomb but not prevent the appropriate destructive power being delivered to a selected target.

REFERENCES:
patent: 3693548 (1972-09-01), Dereich et al.
patent: 4152987 (1979-05-01), Lundstrom et al.
patent: 4448129 (1984-05-01), Gabriels
patent: 4615272 (1986-10-01), Aubert
patent: 4860659 (1989-08-01), Andreetta
patent: 5054399 (1991-10-01), Bilek et al.
patent: 5515785 (1996-05-01), Zglenicki
patent: 5852256 (1998-12-01), Hornig
patent: 5939662 (1999-08-01), Bootes et al.
patent: 7472653 (2009-01-01), Hays et al.
patent: 7845282 (2010-12-01), Sheridan et al.
patent: 2002/0069784 (2002-06-01), Landman et al.
patent: 2007/0051267 (2007-03-01), Meddes et al.
patent: 2010/0263566 (2010-10-01), Ruhlman et al.
International Search Report and Written Opinion, International Patent Application No. PCT/US07/76757, Sep. 22, 2008, 8 pages.

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