Reduced-capacitance component mounting pads and capacitance-redu

Details Reduced-capacitance component mounting pads and capacitance-redu Reduced-capacitance component mounting pads and capacitance-redu

1997-11-11

2000-02-01

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 361767, H01R 909, H01R 2368, H05K 111

Patent

active

060205628

ABSTRACT:
Component mounting pads for multi-layer printed circuit boards encompass a smaller area than conventional pads, reducing parasitic capacitance between the pads and a ground plane layer. A number of such pads are arranged to accommodate standard surface-mount component sizes and packages. Further capacitance reductions are achieved by implementing mesh areas or apertures in the board's ground plane opposite the reduced-capacitance pads.

REFERENCES:
patent: 4889961 (1989-12-01), Carlson
patent: 5375035 (1994-12-01), Stoddard
patent: 5459642 (1995-10-01), Stoddard
patent: 5466892 (1995-11-01), Howard et al.
patent: 5729438 (1998-03-01), Pieper et al.
patent: 5812379 (1998-09-01), Barrow

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