Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of...
Reexamination Certificate
2007-03-27
2007-03-27
Andujar, Leonardo (Department: 2826)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
C257SE21611
Reexamination Certificate
active
10994563
ABSTRACT:
An interfacial oxide layer (185) is formed in the emitter regions of the NPN transistor (280, 220) and the PNP transistor (290, 200). Fluorine is selectively introduced into the polysilicon emitter region of the NPN transistor (220) to reduce the 1/f noise in the NPN transistor.
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patent: 5137839 (1992-08-01), Niitsu
patent: 5552626 (1996-09-01), Morikawa
Moiseiwitsch et al., “Improved base current ideality in polysilicon emitter bipolar transistors by fluorine implantation,” IEE Colloquium on Advanced MOS and Bi-Polar Devices, Feb. 14, 1995, IEE, p. 3/1-3/5.
Siabi-Shahrivar et al., “Modeling and characterization of noise polysilicon emitter bipolar transistors,” Proceedings of the IEEE 1990 Bipolar Circuits and Technology Meeting, Sep. 17-18, 1990, IEEE, p. 236-238.
N. Siabi-Shahrivar, et al., “Modeling and Characterization of Noise of Polysilicon Emitter Bipolar Transistors,”IEEE 1990 Bipolar Circuits and Technology Meeting 10.2, pp. 236-238.
Kyser, Jr. William F.
Loftin William
Trogolo Joe R.
Andujar Leonardo
McLarty Peter K.
Quinto Kevin
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