Redistributed solder pads using etched lead frame

Details Redistributed solder pads using etched lead frame Redistributed solder pads using etched lead frame

2007-06-26

2007-06-26

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S709000, C257S711000, C257S676000, C257SE23031

Reexamination Certificate

active

11231690

ABSTRACT:
A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the annular gap between the die and opening. A process is described for the manufacture of the package in which plural spaced openings in a lead frame body and are simultaneously processed and singulated at the end of the process.

REFERENCES:
patent: 2006/0012016 (2006-01-01), Betz et al.

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