Etching a substrate: processes – Nongaseous phase etching of substrate – Recycling – regenerating – or rejunevating etchant
Patent
1995-05-23
1996-09-17
Powell, William
Etching a substrate: processes
Nongaseous phase etching of substrate
Recycling, regenerating, or rejunevating etchant
216 86, 216105, B44C 122, C23F 100
Patent
active
055565530
ABSTRACT:
A process for control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts, by controlling the temperature and mixture rate of the removal process. The very rapid reaction can be controlled by using a diluent of copper-free etchant, heating to process temperature, then adding spent, copper containing etchant at a controlled rate while actively cooling the system to control the temperature. The copper concentration can be monitored by colorimetry while maintaining the pH above pH 8. The separated metallic copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.
REFERENCES:
patent: 4915776 (1990-04-01), Lee
Krulik Gerald A.
Mandich Nenad V.
Singh Rajwant
Applied Electroless Concepts Inc.
Powell William
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