Rectifying apparatus including six semiconductor diodes sandwich

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Details

357 74, 357 75, 357 80, 357 79, 357 81, H01L 2332, H01L 2302, H01L 2312

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active

042186943

ABSTRACT:
This specification discloses a semiconductor assembly having a semiconductor device sandwiched between two ceramic layers which have a good heat transfer capability and provide for transfer of heat from the semiconductor device through each of the ceramic wafers. The semiconductor assembly can include a plurality of rectifying devices placed between two selectively metalized ceramic wafers and joined to form a semiconductor rectifier for the output of an alternator.

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patent: 3133336 (1964-05-01), Marinace
patent: 3134935 (1964-05-01), Parsons et al.
patent: 3158927 (1964-12-01), Saunders
patent: 3383760 (1968-05-01), Shwartzman
patent: 3593107 (1971-07-01), Chilton et al.
patent: 3646408 (1972-02-01), Kastner
patent: 3648121 (1972-03-01), Suenaga et al.
patent: 3649881 (1972-03-01), Chang et al.
patent: 3697814 (1972-10-01), Christman et al.

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