Rectifier and method

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 74, 357 76, 357 79, H01L 2328, H01L 2302, H01L 2312, H01L 2342

Patent

active

050050699

ABSTRACT:
A rectifier (60) is formedf by soldering a diode chip (66) in a cavity (64) in a metal base (62) having a metal sidewall (69), soldering the head (72) of an axial lead (70) to the chip (66), and filling the cavity (64) with an encapsulation (88). An outward leaning partition (80) is provided in the cavity (64) around and at about the same elevation as the chip (66). The encapsulation (88) covers the lead head (72) and the partition (80), and fills the space between the partition (80) and the base sidewall (69). This locks all the parts together, giving improved reliability and lead stiffnes at low cost.

REFERENCES:
patent: 3513362 (1970-05-01), Yamamoto
patent: 3717523 (1973-02-01), Dunsche
patent: 3743896 (1973-07-01), Weiske et al.
patent: 4303935 (1981-12-01), Ragaly
patent: 4314271 (1982-02-01), Heyke et al.
patent: 4498096 (1985-02-01), Addie et al.
patent: 4532539 (1985-07-01), Friszer

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Rectifier and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Rectifier and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rectifier and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-329957

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.