Rectification chip terminal structure

Details Rectification chip terminal structure Rectification chip terminal structure

2006-10-24

2006-10-24

Patel, Ishwar (Department: 2841)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S687000, C257S696000, C257S177000, C257S690000, C257S688000, C174S267000

Reexamination Certificate

active

07126213

ABSTRACT:
A rectification chip terminal structure for soldering a rectification chip on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conductive element which has a buffer portion and a base seat to prevent bending and deformation under external forces, and has a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.

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patent: 2002/0145192 (2002-10-01), Lin
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