Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – With housing or external electrode
Reexamination Certificate
2006-03-07
2006-03-07
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Regenerative type switching device
With housing or external electrode
C257S693000, C257S690000, C257S687000, C257S688000, C257S689000, C257S731000
Reexamination Certificate
active
07009223
ABSTRACT:
A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conductive element which has a buffer portion and a base seat to prevent the GPP from fracturing when the packaging material is heated and expanded or prevent the conductive element from bending and deforming under external forces, and has a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can prevent the GPP from fracturing when the packaging material is heated and expanded and be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.
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Flynn Nathan J.
Mandala Jr. Victor A.
Sung Jung Minute Industry Co., Ltd.
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