Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2006-01-31
2006-01-31
Ngo, Hung V. (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C174S050510
Reexamination Certificate
active
06992251
ABSTRACT:
A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a helical buffer portion, a base having a boss, a spacer zone containing a space, a tapered section inclining towards the center of the terminal, and a bend spot having latch rings to provide coupling. The terminal thus structured can prevent bending and deformation under external forces, and form a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.
REFERENCES:
patent: 3857993 (1974-12-01), Gregory
patent: 4375008 (1983-02-01), Dathe
patent: 4375578 (1983-03-01), Mitchell et al.
patent: 4420652 (1983-12-01), Ikeno
patent: 4514587 (1985-04-01), Van Dyk Soerewyn
patent: 4644096 (1987-02-01), Gutierrez et al.
patent: 4706106 (1987-11-01), Shiba et al.
patent: 4940855 (1990-07-01), Waitl et al.
patent: 4991291 (1991-02-01), Koepke et al.
patent: 6091022 (2000-07-01), Bodin
patent: 6229088 (2001-05-01), Launtz
Birch & Stewart Kolasch & Birch, LLP
Ngo Hung V.
Sung Jung Minute Industry Co., Ltd.
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