Rectification chip terminal structure

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Reexamination Certificate

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Details

C174S050510

Reexamination Certificate

active

06992251

ABSTRACT:
A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a helical buffer portion, a base having a boss, a spacer zone containing a space, a tapered section inclining towards the center of the terminal, and a bend spot having latch rings to provide coupling. The terminal thus structured can prevent bending and deformation under external forces, and form a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.

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patent: 4420652 (1983-12-01), Ikeno
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patent: 4991291 (1991-02-01), Koepke et al.
patent: 6091022 (2000-07-01), Bodin
patent: 6229088 (2001-05-01), Launtz

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