Rectification chip terminal structure

Details Rectification chip terminal structure Rectification chip terminal structure

2005-10-25

2005-10-25

Quach, T. N. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S687000, C257S696000

Reexamination Certificate

active

06958530

ABSTRACT:
A rectification chip terminal structure for soldering a rectification chip on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a helical buffer portion, a spacer zone containing a space, a tapered section inclining towards the center of the terminal, a bend spot having latch rings to provide coupling, and a deck having a bulged ring. The structure can prevent bending and deformation under external forces, and form a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.

REFERENCES:
patent: 5005069 (1991-04-01), Wasmer et al.
patent: 6060776 (2000-05-01), Spitz et al.
patent: 6160309 (2000-12-01), Le
patent: 6559529 (2003-05-01), Torti et al.
patent: 6894377 (2005-05-01), Huang

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