Rectification chip terminal structure

Details Rectification chip terminal structure Rectification chip terminal structure

2005-05-17

2005-05-17

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S698000

Reexamination Certificate

active

06894377

ABSTRACT:
This invention discloses a rectification chip terminal structure that mounts a rectification chip into a terminal by means of soldering and rubber injection, and inserts the chip into the pivotal hole on the printed wire board. Such terminal comprises a rib ring surrounding the terminal, a platform extended from the middle section of said terminal, a buffer groove formed between said platform and said rib ring, and a protruded ring extended from the periphery of said platform; when rubber is injected into the terminal, the rubber will go through the buffer groove and the protruded ring for the fixing action, and no air bubble will remain after the solidification of the rubber. It will increase the adhesive force between the rubber and the terminal, and also will increase the soldering area of the rectification chip, such that the space between the terminal and the rectification chip can be fully soldered to provide the best effect for a current flow with larger power.

REFERENCES:
patent: 5005069 (1991-04-01), Wasmer et al.
patent: 6060776 (2000-05-01), Spitz et al.
patent: 6559529 (2003-05-01), Torti et al.

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