Rectangular semi-conducting support for microelectronics and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

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Details

C257S077000, C257S705000, C257S713000, C257SE23110, C438S105000

Reexamination Certificate

active

07466019

ABSTRACT:
The semi-conducting support comprises a graphite substrate having a front surface and a rear surface and at least a first stack arranged on the front surface of the substrate. The first stack successively comprises a single-crystal diamond layer, an electrically insulating oxide layer and a semi-conducting layer. The support can comprise a second stack arranged on the rear surface of the substrate and comprising the same succession of layers as the first stack or comprising a polymer material layer. A thermal connection passing through the first and/or second stacks and connecting the graphite substrate to an external surface of the support enables heat to be removed. The method can comprise production of the semi-conducting layer by molecular bonding of rectangular silicon strips onto the oxide layer.

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Schonecker et al., “Ribbon-Growth-on-Substrate: Progress in High Speed Crystalline Silicon Wafer Manufacturing,” 29thIEEE Photovoltaic Specialists Conference, New Orleans, USA, May 22-24, 2002.
Schonecker et al., “Ribbon-Growth-on-Substrate: Status, Challenges and Promises of High Speed Silicon Wafer Manufacturing,” 12thWorkshop on Crystalline Silicon Solar Cells, Materials and Processes, 2002.
Khattak et al., “Current Status of HEM Grown Silicon Ingots,” NREL/SNL Photovoltaics, Program Review Meeting, Lakeview CO, USA, Nov. 18-22, 1996.

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