Recovery of coolant and abrasive grains used in slicing semicond

Details Recovery of coolant and abrasive grains used in slicing semicond Recovery of coolant and abrasive grains used in slicing semicond

1997-02-14

1999-12-14

Popovics, Robert J.

Liquid purification or separation

Processes

Making an insoluble substance or accreting suspended...

210714, 210737, 210773, 210774, 210781, 210787, 210171, 210168, 209 5, B01D 2101

Patent

active

06001265&

ABSTRACT:
A system for reusing water soluble slurry waste fluid wherein separated available abrasive grains and extracted water soluble coolant are reused. This system is capable of reducing a disposal cost due to a reduction of a load to a waste water disposal plant by effectively reusing water soluble slurry waste fluid, and making a contribution to a reduction of a total slicing cost by reusing abrasive grains and water soluble coolant.

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patent: 5127199 (1992-07-01), Blankers et al.
patent: 5578222 (1996-11-01), Trischuk et al.
patent: 5647989 (1997-07-01), Hayashi et al.

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