Measuring and testing – Vibration – By mechanical waves
Patent
1975-12-29
1978-02-21
Queisser, Richard C.
Measuring and testing
Vibration
By mechanical waves
73606, 73609, 73641, G01N 2904
Patent
active
040745643
ABSTRACT:
Short bursts of ultrasonic energy are directed through a three-dimensional specimen to determine the spatial distribution of those structures within the specimen capable of affecting the waveform of the energy. Transducers are placed in spaced positions about the periphery of the specimen to measure the affected parameters (such as attenuation and delay time) of the energy as a result of passing through the specimen along paths between the spaced transducers. The output signals containing this transit time and energy absorption information are retained in a data storage device. Through conventional programming techniques, a computer processes the data and calculates a velocity or absorption profile for each path. The profiles are collectively used to reconstruct two-dimensional or three-dimensional images of the specimen.
REFERENCES:
patent: 2612772 (1952-10-01), McConnell
patent: 2971372 (1961-02-01), Lewis et al.
patent: 3024644 (1962-03-01), Fry et al.
patent: 3052115 (1962-09-01), Renaut et al.
patent: 3673394 (1972-06-01), Hartman
patent: 3756071 (1973-09-01), Dory
patent: 3771355 (1973-11-01), Sachs
patent: 3778614 (1973-12-01), Hounsfield
patent: 3857052 (1974-12-01), Beller
Young, D., Collecting and Processing Automatic Inspection Data, Ultrasonics, Jan. 1969, pp. 51-56.
Beauchamp John P.
Cole Stanley Z.
Morrissey John J.
Queisser Richard C.
Sgarbossa Peter J.
LandOfFree
Reconstruction system and method for ultrasonic imaging does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reconstruction system and method for ultrasonic imaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reconstruction system and method for ultrasonic imaging will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-119866