Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-10-24
2006-10-24
Chang, Daniel D. (Department: 2819)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C326S041000, C257S723000, C257S777000, C712S015000
Reexamination Certificate
active
07126214
ABSTRACT:
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.
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Guzy D. James
Huppenthal Jon M.
Arbor Company LLP
Chang Daniel D.
Hogan & Hartson LLP
Kubida William J.
Meza Peter J.
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