Reconfigurable processor module comprising hybrid stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reissue Patent

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C257S685000, C257S209000, C257S529000, C257S700000, C257S530000, C257S922000, C361S767000, C361S783000, C361S778000, C326S051000

Reissue Patent

active

RE042035

ABSTRACT:
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

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