Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reissue Patent
2011-01-18
2011-01-18
Tan, Vibol (Department: 2819)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S685000, C257S209000, C257S529000, C257S700000, C257S530000, C257S922000, C361S767000, C361S783000, C361S778000, C326S051000
Reissue Patent
active
RE042035
ABSTRACT:
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.
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Guzy D. James
Huppenthal Jon M.
Arbor Company LLP
Hogan & Lovells US LLP
Kubida William J.
Meza Peter J.
Tan Vibol
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