Electricity: electrical systems and devices – Control circuits for electromagnetic devices – For relays or solenoids
Reexamination Certificate
2000-07-21
2003-02-18
Vu, Bao Q. (Department: 2838)
Electricity: electrical systems and devices
Control circuits for electromagnetic devices
For relays or solenoids
C257S691000, C257S698000, C257S700000
Reexamination Certificate
active
06522518
ABSTRACT:
FIELD OF INVENTION
The invention described herein related to the packaging of electronic processing components in a computer system, and more particularly to an apparatus which provides for the monitoring and modification of electrical connections between the electronic processing components.
BACKGROUND OF THE INVENTION
As airplane and spacecraft have become more technologically sophisticated, there has been a greater need to include more electronic components on the vehicles. For example, avionics systems which are employed to control flight and other aspects of the aircraft and/or spacecraft, require a great number of electronic processing components as well as input/output and interconnected signal lines so that the various components may communicate.
Typically, an aircraft or spacecraft will carry a number of “black boxes” which include circuit cards designed to perform particular functions. A number of circuit cards may be positioned in each black box and electrical connections provided from each circuit card. These electrical connections may be made to a motherboard, which in turn provides for communication from a particular black box with any number of remotely located systems.
The integrated circuits which are employed in the black boxes described above may be packaged in what is known as a multichip module (MCM). A MCM is a chip carrier within which various computer chips may be located with electrical connections provided between chips as well as to external components. Most commonly, these multichip modules are incorporated in multi-layer dielectric substrates that employ thin film processes for form electrically conductive traces to interconnect the various chips. The multi-layer dielectric substrates are made employing techniques that have been initially developed for various types of semi-conductive type processing. These MCMs may include high density interconnect (HDI) technology. In an MCM, many chips may be connected in close proximity to each other.
SUMMARY OF THE INVENTION
When MCM's or other electronic components are included in an electronic assembly, a typical configuration is incorporate external electrical contacts on the outside surfaces of these components and to stack these items in a manner such that desired electrical connections are established. Once the components are aligned, a compressive force may be applied to hold the assembly together. One draw-back of this configuration is that over time the physical characteristics of the external electrical contacts may deteriorate such that electrical resistance across the contacts may vary. The inventor has recognized that certain apparatus may be provided with the electronic assembly and certain steps performed during operation of the electrical components such that good electrical connections may be maintained.
Described herein is an electronics apparatus which includes the functionality for measuring the quality of certain electrical contacts within a stacked electronic assembly and for performing certain steps to improve the conductivity through these contacts when detected resistance rises above a pre-determined level. Included in the apparatus are a plurality of electronic components wherein each of these components has at least one external electrical contact. Running through each of the electronic components are conductive traces which comprise a feedback circuit over which pre-determined current may be transmitted such that a voltage drop over the circuit may be measured. This measurement may be converted to a resistance calculation for the circuit.
Further included in the electronics apparatus may be a force actuator device which is in electrical connection with the resistance measurement device. The force actuator device may include at least one force actuator which is positionable on the electronic assembly such that it may exert a compressive force on the stacked electrical components when activated. This activation may be in response to receipt of a control signal from the resistance measurement device.
In one configuration of the invention, the electronic assembly components may include a multichip module (MCM), an interposer, and a circuit card interface for providing interconnection of the electronic assembly with remotely located systems. These electronic components may be in a stacked configuration such that the external electrical contacts on the external surfaces of each of the components are in contact with each other. In the stacked configuration, the interposer is positioned between the MCM and the circuit card interface. The interposer is configured such that the electrical contacts run through the thickness of this component. The contacts may be shaped such that when a compressive force is applied to said contacts, the external portions of the contact move in a desired fashion. In one configuration of the invention, these components may have a “Z” shape.
To provide for the application of a compressive force to the electronic assembly described herein, a base plate structure may be provided wherein this structure includes a plurality of alignment pins extending therefrom. Incorporated into the other components of the assembly described herein, may be alignment holes through which said pins may pass. When the components are in the stacked configuration and the alignment pins are running through each component, the external electrical contacts on each of the components shall be in electrical connection with their electrical contacts.
On the opposite side of the stacked configuration from the base plate structure may be the resistance measurement device and force actuator assembly in a self-contained structure. This structure may be configured such that it includes apparatus for receiving and engaging the alignment pins. The alignment pins may be received by specially configured force actuation motors which contact the alignment pins and apply a force to said alignment pins such that a desired compressive force is applied to the stacked electronic assembly. In one configuration of the invention, the force actuator devices may comprise piezoceramic inchworm motors which attempt to move along the alignment pins in response to a received voltage. In another configuration of the invention, the force actuators may comprise at least one shape memory alloy motors positioned relative to the stacked electronic assembly which is in electrical connection with a controller such that the motors moves in a fashion such that a variable compressive force is applied to the stacked electronic assembly. In yet another configuration of the invention, electromechanical actuators may be physically attached to the exterior surfaces of the electronic assembly where an electrical connection is established between the actuators and an electronic controller.
In yet another configuration of the invention, the current source, voltage measuring device, and force actuator may be incorporated into a microprocessor. This microprocessor may include external pins or connectors for establishing a connection with the feedback circuits as well as the force actuators which are employed.
The stacked electronic assembly described herein may be further be employed in a specially adapted system for loading and unloading MCMs. Included in this apparatus is a black box structure for holding a plurality of stacked electronic assemblies. Electrical connections are provided through the black box structure such that electrical signals may be transmitted via the circuit card interface to remotely located structures. In connection with the black box structure is a movable MCM magazine which is electrically controllable to move in a desired direction relative to position of electronic assemblies within the MCM stack structure. Further, an MCM insert/remove actuator is employed in conjunction with the MCM magazine such that one MCM can be removed from the stacked electronic assembly and a new one inserted. The MCM stacked structure can be configured such that electronic signals may be transmitted to the force actuator such tha
Lockhead Martin Corporation
Marsh & Fischmann & Breyfogle LLP
Vu Bao Q.
LandOfFree
Reconfigurable multichip module stack interface does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reconfigurable multichip module stack interface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reconfigurable multichip module stack interface will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3132387