Reconfigurable array of test structures and method for testing a

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324765, G01R 3102, G01R 3128

Patent

active

059528389

ABSTRACT:
A reconfigurable array of test structures for testing portions of a semiconductor device, comprising a plurality of probe pads, comprising a first probe pad and a remainder of probe pads, at least one of which remainder of probe pads is a common lead; to each of said plurality of probe pads, except for said common lead, are attached two conductors; in each of which said two conductors is connected a test structure, a first end of which semiconductor device is connected to said conductor and a second end of which test structure is connected to said common lead, except for said first probe pad, for which first probe pad only a test structure is connected in the first conductor of the two conductors and a fusible link in the second conductor of the two conductors connected to said common lead; wherein one of each of said two conductors contains a fusible link connected in series with said test structure; and a method for testing portions of a semiconductor device employing such a reconfigurable array of test structures are described.

REFERENCES:
patent: 4956602 (1990-09-01), Parrish
patent: 4961053 (1990-10-01), Krug
patent: 5341092 (1994-08-01), El-Ayat et al.
patent: 5532614 (1996-07-01), Chiu

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