Recognition device, bonding device, and method of...

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...

Reexamination Certificate

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Reexamination Certificate

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07093744

ABSTRACT:
The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device21, shielding lids31, 32, and33are disposed at upper and lower parts of a ring illumination25and at a lower part of lens barrel29. Shimmer37of nitrogen gas that blows out from a working hole24can thus be prevented from entering inside ring illumination25, especially by shielding lid31at the lower part of ring illumination25. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the μm order can be improved.

REFERENCES:
patent: 6234376 (2001-05-01), Wicen
patent: 6715660 (2004-04-01), Seki et al.
patent: 6729528 (2004-05-01), Seki et al.
patent: 6824037 (2004-11-01), Sakai et al.
patent: 2003/0019906 (2003-01-01), Sakai et al.
patent: 2004/0154742 (2004-08-01), Seki et al.
patent: 2004/0155089 (2004-08-01), Seki et al.
patent: 63-29535 (1988-02-01), None

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