Recognition device, bonding device, and method of...

Details Recognition device, bonding device, and method of... Recognition device, bonding device, and method of...

2006-06-27

2006-06-27

Kerns, Kevin P. (Department: 1725)

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

Reexamination Certificate

active

07066372

ABSTRACT:
The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device21provided with recognition device, a shimmer prevention blow mechanism31is disposed between a ring illumination25and a working hole24and near working hole24. Though the nitrogen gas that blows out from working hole24gives rise to shimmer due to temperature difference, this shimmer can be blown away by the nitrogen gas blow from shimmer prevention blow mechanism31. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the μm order can be improved.

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patent: 2004/0154742 (2004-08-01), Seki et al.
patent: 2004/0155089 (2004-08-01), Seki et al.
patent: 63-29535 (1988-02-01), None

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