Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating moving substrate
Patent
1996-06-17
1997-09-23
Valentine, Donald R.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating moving substrate
205146, 204212, 204222, 204224R, 204DIG7, C25D 504, C25D 1700
Patent
active
056700342
ABSTRACT:
A plating system (10) for plating a substrate such as a semiconductor wafer (116) in an electrolytic tank (12). A fixture wheel (14) is mounted within the electrolytic tank to rotate about a first axis (140). The fixture wheel receives the semiconductor wafer and supplies electrical current to the perimeter edge of the wafer. A fixture wheel drive motor (90) drives rotation of the fixture wheel about the first axis. An anode assembly (18) is mounted in the tank spaced from and facing towards the fixture wheel and received semiconductor wafer. The anode assembly carries first and second anodes (72) which are supplied with electrical current. A second motor (142) causes reciprocation of the anode assembly transversely in front of the rotating fixture wheel for improved uniformity in plating thickness and composition.
REFERENCES:
patent: 1793483 (1931-02-01), Hewitt
patent: 3271290 (1966-09-01), Pianowski
patent: 3796646 (1974-03-01), Zambon
patent: 3844542 (1974-10-01), Strecke
patent: 3915832 (1975-10-01), Rackus et al.
patent: 4022678 (1977-05-01), Wojcik et al.
patent: 4259166 (1981-03-01), Whitehurst
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4359375 (1982-11-01), Smith
patent: 4539079 (1985-09-01), Okabayashi
patent: 4817341 (1989-04-01), Umeda
patent: 4879007 (1989-11-01), Wong
patent: 4992145 (1991-02-01), Hickey
patent: 5167779 (1992-12-01), Henig
patent: 5316642 (1994-05-01), Young, Jr. et al.
patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5472592 (1995-12-01), Lowery
patent: 5484513 (1996-01-01), Dejneko et al.
patent: 5501787 (1996-03-01), Bassous et al.
American Plating Systems
Valentine Donald R.
LandOfFree
Reciprocating anode electrolytic plating apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reciprocating anode electrolytic plating apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reciprocating anode electrolytic plating apparatus and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1937675