Recessed via apparatus for testing, burn-in, and/or programming

Details Recessed via apparatus for testing, burn-in, and/or programming Recessed via apparatus for testing, burn-in, and/or programming

1994-07-01

1995-09-05

Heinrich, Samuel M.

Textiles: manufacturing

Warp preparing or handling

Machine replenishing

228 565, 228 62, H05K 334, B23K 3704, B23K 306

Patent

active

054472644

ABSTRACT:
A temporary substrate for solder bumps may be used to transfer solder bumps to a microelectronic device. The temporary substrate includes a solder nonwettable surface and a plurality of conductive vias therein. A solder bump is formed on each of the conductive vias and is electrically and mechanically connected thereto. The solder bump extends over the solder nonwettable surface to produce a solder bump cross-sectional area which is greater than the cross-sectional area of the conductive via. A microelectronic device is placed adjacent the temporary substrate with each input/output pad adjacent a respective solder bump. An electrical and mechanical connection is formed between the solder bump and the input/output pad, and the microelectronic device is separated from the temporary substrate with the solder bump remaining connected to the input/output pad. The temporary substrate can also be used for burn-in and testing of microelectronic devices and rework on multichip modules.

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