Recessed thermally conductive packaged semiconductor devices

Details Recessed thermally conductive packaged semiconductor devices Recessed thermally conductive packaged semiconductor devices

1989-04-10

1990-05-08

Shoop, Jr., William M.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361385, 174 522, H05K 720

Patent

active

049243519

ABSTRACT:
A packaged semiconductor device having a semiconductor chip mounted on a bed part, a first molded layer which seals the bed part and the semiconductor chip such that the back of the bed part is exposed, a heat sink under the exposed back of the bed part and with a prescribed distance between it and the back of the bed part a second molded layer which is formed such that it covers the outside of the heat sink and the first molded layer, and also fills the gap between the exposed surface of the bed part and the heat sink, and leads which are disposed such that they pass through the second molded layer and their ends are in the first molded layer, and which are connected via bonding wires to the internal terminals of the semiconductor chip.

REFERENCES:
patent: 3585455 (1971-06-01), Naylor
patent: 3646409 (1972-02-01), van de Water et al.
patent: 3689804 (1972-09-01), Ishihama et al.
patent: 3706840 (1972-12-01), Moyle et al.
patent: 3767839 (1973-10-01), Beal
patent: 3839660 (1974-10-01), Stryzer
patent: 3930114 (1975-12-01), Hodge
patent: 4048670 (1977-09-01), Eysermans
patent: 4467522 (1984-09-01), Marchisi
patent: 4481380 (1984-11-01), Wood et al.
patent: 4483067 (1984-11-01), Parmentier
patent: 4542260 (1985-09-01), Pearce
patent: 4628146 (1986-12-01), Schmotz et al.
patent: 4642716 (1987-02-01), Wababayashi et al.
TOSHIBA REVIEW (vol. 35, No. 2) p. 141, "A High-Output Photothyristor Coupler"; Hiroaki Takasago, Takao Katayama, Feb. 1980.

Affiliated with

Also associated with

Rating

Recessed thermally conductive packaged semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Recessed thermally conductive packaged semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Recessed thermally conductive packaged semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2353568