Recessed or raised characters on a ceramic lid

Details Recessed or raised characters on a ceramic lid Recessed or raised characters on a ceramic lid

1997-04-07

1999-06-29

Dutton, Brian

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257703, 257697, 257797, H01L 2100, H01L 2304

Patent

active

059172398

ABSTRACT:
A method for pressing an identification mark into a ceramic lid of an integrated circuit package. The method includes the steps of mixing an oxide material with a binder to create a powder. The powder is then placed into a mold and pressed into a substrate with a press. The bottom of the press has raised or recessed portions arranged in the pattern of an identification mark. The raised or recessed portions press the mark into the powder when the powder is pressed into a substrate. The substrate is then removed from the mold and heated to harden the powder into a ceramic lid. The recessed or raised indicia are relatively deep and wide so that it is difficult to remove the mark with known grinding or laser techniques.

REFERENCES:
patent: 4626960 (1986-12-01), Hamano et al.
patent: 4833102 (1989-05-01), Byrne et al.
Translated Document of Japan 6-216265, Aug. 5, 1994.

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