Recessed flip-chip package

Details Recessed flip-chip package Recessed flip-chip package

1998-07-21

2000-11-28

Gandhi, Jayprakash N.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361764, 361748, 361803, 257723, H05K 118

Patent

active

061543705

ABSTRACT:
The specification describes a recessed chip IC package in which the cavity in the printed wiring board into which the IC chip is recessed is used as a through hole interconnection, thus increasing the interconnection density. If the through cavity interconnections are used as power and ground the signal I/O pads and the signal runners are effectively isolated.

REFERENCES:
patent: 5608262 (1997-03-01), Degani et al.
patent: 5715144 (1998-02-01), Ameen et al.
patent: 5786986 (1998-07-01), Bregman et al.
patent: 5869894 (1999-02-01), Degani et al.

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